Rohan N. Akolkar : rechercher sur Z-Library

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Articles (49)
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Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature

Akolkar, Rohan

Journal:

Journal of Power Sources

Année:

2014

Langue:

english

Fichier:

PDF, 766 KB

english, 2014

Mechanistic Analysis of the “Bottom-Up” Fill in Copper Interconnect Metallization

Akolkar, Rohan, Landau, Uziel

Journal:

Journal of The Electrochemical Society

Année:

2009

Langue:

english

Fichier:

PDF, 268 KB

english, 2009

Modeling of the Current Distribution in Aluminum Anodization

Rohan Akolkar, Uziel Landau, Harry Kuo, Yar-Ming Wang

Journal:

Journal of Applied Electrochemistry

Année:

2004

Langue:

english

Fichier:

PDF, 198 KB

english, 2004

Mathematical model of the dendritic growth during lithium electrodeposition

Akolkar, Rohan

Journal:

Journal of Power Sources

Année:

2013

Langue:

english

Fichier:

PDF, 412 KB

english, 2013

[Nanostructure Science and Technology] Copper Electrodeposition for Nanofabrication of Electronics Devices ||

Kondo, Kazuo, Akolkar, Rohan N., Barkey, Dale P., Yokoi, Masayuki

Année:

2014

Langue:

english

Fichier:

PDF, 11.53 MB

english, 2014

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Direct seed electroplating of copper on ruthenium liners

Akolkar, Rohan, Indukuri, Tejaswi, Clarke, James, Ponnuswamy, Thomas, Reid, Jonathan, McKerrow, Andrew J., Varadarajan, Sesha

Année:

2011

Langue:

english

Fichier:

PDF, 904 KB

english, 2011

Pulse plating of copper germanide

Joi, Aniruddha, Akolkar, Rohan, Landau, Uziel

Journal:

Applied Physics Letters

Année:

2013

Langue:

english

Fichier:

PDF, 845 KB

english, 2013

Suppressing Dendritic Growth during Alkaline Zinc Electrodeposition using Polyethylenimine Additive

Banik, Stephen J., Akolkar, Rohan

Journal:

Electrochimica Acta

Année:

2014

Langue:

english

Fichier:

PDF, 1.89 MB

english, 2014

Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects

Mendez, Julie, Akolkar, Rohan, Landau, Uziel

Journal:

Journal of The Electrochemical Society

Année:

2009

Langue:

english

Fichier:

PDF, 548 KB

english, 2009

Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization

Yu, Lu, Vashaei, Zahra, Ernst, Frank, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2016

Langue:

english

Fichier:

PDF, 766 KB

english, 2016

Communication—Electrochemical Atomic Layer Etching of Copper

Gong, Yukun, Venkatraman, Kailash, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2018

Langue:

english

Fichier:

PDF, 541 KB

english, 2018

Electrochemistry-enabled atomic layer deposition of copper: Investigation of the deposit growth rate and roughness

Venkatraman, Kailash, Gusley, Ryan, Lesak, Andrew, Akolkar, Rohan

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Année:

2019

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2019

Editors' Choice—Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes

Joi, Aniruddha, Venkatraman, Kailash, Tso, Kuang-Chih, Dictus, Dries, Dordi, Yezdi, Wu, Pu-Wei, Pao, Chih-Wen, Akolkar, Rohan

Journal:

ECS Journal of Solid State Science and Technology

Année:

2019

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2019

Kinetics of the electrolytic coloring process on anodized aluminum

Rohan Akolkar, Yar-Ming Wang, Hong-Hsiang (Harry) Kuo

Journal:

Journal of Applied Electrochemistry

Année:

2007

Langue:

english

Fichier:

PDF, 234 KB

english, 2007

Electrical and reliability characterization of CuMn self forming barrier interconnects on low-k CDO dielectrics

Tejaswi K. Indukuri, Rohan N. Akolkar, James S. Clarke, Arda Genc, Florian Gstrein, Michael C. Harmes, Barbara Miner, Feng Xia, Daniel J. Zierath, Sridhar Balakrishnan

Journal:

Microelectronic Engineering

Année:

2012

Langue:

english

Fichier:

PDF, 950 KB

english, 2012

Pattern Density Effect on the Bottom-Up Fill during Damascene Copper Electrodeposition

Akolkar, Rohan, Dubin, Valery

Journal:

Electrochemical and Solid-State Letters

Année:

2007

Langue:

english

Fichier:

PDF, 261 KB

english, 2007

A Mechanistic Model for Copper Electropolishing in Phosphoric Acid

Mendez, Julie, Akolkar, Rohan, Andryushchenko, Tatyana, Landau, Uziel

Journal:

Journal of The Electrochemical Society

Année:

2008

Langue:

english

Fichier:

PDF, 573 KB

english, 2008

Three dimensional graphene foam supported platinum–ruthenium bimetallic nanocatalysts for direct methanol and direct ethanol fuel cell applications

Kung, Chih-Chien, Lin, Po-Yuan, Xue, Yuhua, Akolkar, Rohan, Dai, Liming, Yu, Xiong, Liu, Chung-Chiun

Journal:

Journal of Power Sources

Année:

2014

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2014

Charge transfer processes at the interface between plasmas and liquids

Akolkar, Rohan, Sankaran, R. Mohan

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Année:

2013

Langue:

english

Fichier:

PDF, 1.82 MB

english, 2013

A Time-Dependent Transport-Kinetics Model for Additive Interactions in Copper Interconnect Metallization

Akolkar, Rohan, Landau, Uziel

Journal:

Journal of The Electrochemical Society

Année:

2004

Langue:

english

Fichier:

PDF, 186 KB

english, 2004

Generation of a direct-current, atmospheric-pressure microplasma at the surface of a liquid water microjet for continuous plasma-liquid processing

Ghosh, Souvik, Bishop, Brittany, Morrison, Ian, Akolkar, Rohan, Scherson, Daniel, Mohan Sankaran, R.

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Année:

2015

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2015

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Novel High Molecular Weight Levelers Extending Gap Fill to Smaller Features

Adolf, James, Akolkar, Rohan, Landau, Uziel

Année:

2009

Langue:

english

Fichier:

PDF, 336 KB

english, 2009

[Nanostructure Science and Technology] Copper Electrodeposition for Nanofabrication of Electronics Devices || Through Hole Plating

Kondo, Kazuo, Akolkar, Rohan N., Barkey, Dale P., Yokoi, Masayuki

Année:

2014

Langue:

english

Fichier:

PDF, 875 KB

english, 2014

[ECS 209th ECS Meeting - Denver, Colorado (May 7-May 12, 2006)] ECS Transactions - Advanced Electrochemical Processes for Sub-50 nm On-chip Metallization

Akolkar, Rohan, Cheng, Chin-Chang, Chebiam, Ramanan, Fajardo, Arnel, Dubin, Valery

Année:

2007

Langue:

english

Fichier:

PDF, 472 KB

english, 2007

Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers

Miller, Alexander, Yu, Lu, Blickensderfer, Jacob, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2015

Langue:

english

Fichier:

PDF, 2.32 MB

english, 2015

Communication—Underpotential Deposition of Lead for Investigating the Early Stages of Electroless Copper Deposition on Ruthenium

Yu, Lu, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2016

Langue:

english

Fichier:

PDF, 752 KB

english, 2016

Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc

Venkatraman, Kailash, Gusley, Ryan, Yu, Lu, Dordi, Yezdi, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2016

Langue:

english

Fichier:

PDF, 868 KB

english, 2016

ChemInform Abstract: Charge Transfer Processes at the Interface Between Plasmas and Liquids

Akolkar, Rohan, Sankaran, R. Mohan

Journal:

ChemInform

Année:

2014

Fichier:

PDF, 17 KB

2014

Effect of tungsten alloying on short-to-medium-range-order evolution and crystallization behavior of near-eutectic amorphous Ni–P

Zhan, Xun, Zhang, Pei, Voyles, Paul M., Liu, Xinyu, Akolkar, Rohan, Ernst, Frank

Journal:

Acta Materialia

Année:

2017

Langue:

english

Fichier:

PDF, 3.28 MB

english, 2017

Determination of the Diffusion-Adsorption Properties of Polymeric Electrolyte Additives Using an Additive Injection Method Implemented on a Rotating Disc Electrode

Banik, Stephen J., Rao, Karun K., Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2016

Langue:

english

Fichier:

PDF, 789 KB

english, 2016

Mechanism of Electroless Copper Deposition from [Cu II EDTA] 2– Complexes Using Aldehyde-Based Reductants

Zhao, Meng, Yu, Lu, Akolkar, Rohan, Anderson, Alfred B.

Journal:

The Journal of Physical Chemistry C

Année:

2016

Langue:

english

Fichier:

PDF, 1.54 MB

english, 2016

Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces

Rao, Karun K., Ferguson, Molly, Murphy, Kyle, Zhao, Jean, Lacks, Daniel, Akolkar, Rohan

Journal:

Journal of Applied Electrochemistry

Année:

2016

Langue:

english

Fichier:

PDF, 1.52 MB

english, 2016

Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surface-Limited Redox Replacement of Underpotentially Deposited Zinc

Venkatraman, Kailash, Dordi, Yezdi, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2017

Langue:

english

Fichier:

PDF, 709 KB

english, 2017

Lead underpotential deposition for the surface characterization of silver ad-atom modified gold electrocatalysts for glucose oxidation

Yu, Lu, Akolkar, Rohan

Journal:

Journal of Electroanalytical Chemistry

Année:

2017

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2017

Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel–Phosphorus

Liu, Xinyu, Richtering, Werner, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2017

Langue:

english

Fichier:

PDF, 860 KB

english, 2017

Electrodeposition of Neodymium from NdCl 3 -Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling

Shen, Dai, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2017

Langue:

english

Fichier:

PDF, 824 KB

english, 2017

Communication—Electrochemical Sensor Concept for the Detection of Lead Contamination in Water Utilizing Lead Underpotential Deposition

Liu, Xinyu, Venkatraman, Kailash, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2018

Langue:

english

Fichier:

PDF, 544 KB

english, 2018

Electroless atomic layer deposition of copper

Venkatraman, Kailash, Joi, Aniruddha, Dordi, Yezdi, Akolkar, Rohan

Journal:

Electrochemistry Communications

Année:

2018

Langue:

english

Fichier:

PDF, 1.27 MB

english, 2018

Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li + Transport within the Solid Electrolyte Interphase

Maraschky, Adam, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2018

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2018

Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu 2+ → Cu 1+ Reduction Reaction in Deep Eutectic Solvents

Shen, Dai, Steinberg, Katherine, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2018

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2018

Effect of tungsten alloying on magnetic properties of amorphous Ni-P

Zhan, Xun, Daniil, Maria, Liu, Xinyu, Willard, Matthew A., Akolkar, Rohan, Ernst, Frank

Journal:

Journal of Alloys and Compounds

Année:

2019

Langue:

english

Fichier:

PDF, 41.07 MB

english, 2019

Plasma-induced fabrication and straining of MoS2 films for the hydrogen evolution reaction

Liu, Tianqi, Liu, Xinyu, Bhattacharya, Souvik, Ye, Zhipeng, He, Rui, Gao, Xuan P.A., Akolkar, Rohan, Sankaran, R. Mohan

Journal:

ACS Applied Energy Materials

Année:

2019

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2019

Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition

Liu, Xinyu, Bolton, Onas, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2019

Langue:

english

Fichier:

PDF, 1.70 MB

english, 2019

Editors' Choice—Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes

Joi, Aniruddha, Venkatraman, Kailash, Tso, Kuang-Chih, Dictus, Dries, Dordi, Yezdi, Wu, Pu-Wei, Pao, Chih-Wen, Akolkar, Rohan

Journal:

ECS Journal of Solid State Science and Technology

Année:

2019

Fichier:

PDF, 1.23 MB

2019

Understanding the Role of Complexation in the Charge-Transfer Kinetics of the Cu 2+ + e ↔ Cu 1+ Redox Reaction in Ethaline Deep Eutectic Solvent

Shen, Dai, Vukmirovic, Miomir B., Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2019

Fichier:

PDF, 805 KB

2019

Temperature Dependence of Dendritic Lithium Electrodeposition: A Mechanistic Study of the Role of Transport Limitations within the SEI

Maraschky, Adam, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2020

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2020

Hysteresis effects and roughness suppression efficacy of polyethylenimine additive in Cu electrodeposition in ethaline

Shaheen, Nora A., Mahesh, Ijjada, Vukmirovic, Miomir B., Akolkar, Rohan

Journal:

Electrochemistry Communications

Année:

2020

Fichier:

PDF, 2.00 MB

2020

Electrochemical Atomic Layer Etching of Ruthenium

Gong, Yukun, Akolkar, Rohan

Journal:

Journal of The Electrochemical Society

Année:

2020

Fichier:

PDF, 1022 KB

2020

Copper Electrodeposition from Deep Eutectic Solvents â Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs. Glassy Carbon

Vukmirovic, Miomir B., Adzic, Radoslav R., Akolkar, Rohan

Journal:

Journal of Physical Chemistry B

Année:

2020

Fichier:

PDF, 1.20 MB

2020